Analysis of the advantages and disadvantages of aluminum substrates!

As a senior industry practitioner, today I will sort out the comprehensive advantages and disadvantages of aluminum substrates, as well as use analysis, I hope it will be helpful to you!

The aluminum substrate is a metal-based copper-clad laminate with good heat dissipation function. Generally, a single panel is composed of a three-layer structure, which is a circuit layer, an insulating layer, and a metal base layer. For high-end use, it is also designed as a double-sided board, and the structure is circuit layer, insulating layer, aluminum base, insulating layer, and circuit layer. Very few applications are multi-layer boards, which can be formed by bonding ordinary multi-layer boards with insulating layers and aluminum bases.

Advantages of aluminum substrate

(1) The heat dissipation is significantly better than the standard FR-4 structure.

(2) The thermal conductivity of the dielectric used is usually 5 to 10 times that of conventional epoxy glass, and the thickness is only one-tenth.

(3) The heat transfer index is more efficient than traditional rigid PCB.

(4) It is possible to use a lower copper weight than shown in the IPC recommendation chart.

Analysis of the advantages and disadvantages of aluminum substrates!插图

The aluminum substrate is mainly used in

(1) Audio equipment: input and output amplifiers, balanced amplifiers, audio amplifiers, preamplifiers, power amplifiers, etc.

(2) Power supply equipment: switching regulators, DC/AC converters, SW regulators, etc.

(3) Communication electronic equipment: high-frequency amplifiers, filter appliances, and transmission circuits.

(4) Office automation equipment: motor drives, etc.

(5) Automobiles: electronic regulators, igniters, power controllers, etc.

(6) Computer: CPU board, floppy disk drive, power supply unit, etc.

(7) Power modules: inverters, solid state relays, rectifier bridges, etc.

Aluminum substrates have a wide range of uses. Generally, there are aluminum substrates in audio equipment, power supply equipment, communication electronic equipment, office automation equipment, automobiles, computers, and power modules.

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